Flash память фирмы Samsung Semiconductor

Old Part Number New Part Number Organization Operating Voltage,
V		 Temperature Package Production Status Comments
NAND
KM29W040AT K9F4008W0A 512K x 8 3.0~5.5 C, I 44 TSOP2 Mass Production  
KM29W8000T K9F8008W0M 1M x 8 2.7~5.5 C, I 44 TSOP2 Mass Production  
KM29W16000AT K9F1608W0A 2M x 8 2.7~5.5 C , I 44 TSOP2 Mass Production  
KM29W16000BT K9F1608W0B 2.7~5.5 C, I 44 TSOP2 Under Development  
KM29W32000AT K9F3208W0A 4M x 8 2.7~5.5 C , I 44 TSOP2 Mass Production  
KM29U64000AT K9F6408U0A 8M x 8 2.7~3.6 C , I 44 TSOP2 Under Development  
KM29U64000T K9F6408U0M 2.7~3.6 C , I 44 TSOP2 Mass Production  
KM29U128AT K9F2808U0A 16M x 8 2.7~3.6 C , I 48 TSOP1 Under Development  
KM29U128T K9F2808U0M 2.7~3.6 C , I 48 TSOP1 Mass Production  
KM29U256T K9F5608U0M 32M x 8 2.7~3.6 C , I 48 TSOP1 Under Development  
SmartMedia
SMFV002 K9S1608V0A 2M x 8 3.0~3.6 0~55°C 22 PAD Mass Production  
SMFV002A K9S1608V0B 3.0~3.6 0~55°C 22 PAD Under Development  
SMFV004A K9S3208V0A 4M x 8 3.0~3.6 0~55°C 22 PAD Under Development  
SMFV004 - 3.0~3.6 0~55°C 22 PAD Mass Production  
SMFV008A K9S6408V0A 8M x 8 2.7~3.6 0~55°C 22 PAD Under Development  
SMFV008 K9S6408V0M 2.7~3.6 0~55°C 22 PAD Mass Production  
SMFV016A K9S2808V0A 16M x 8 2.7~3.6 0~55°C 22 PAD Under Development  
SMFV016 K9S2808V0M 2.7~3.6 0~55°C 22 PAD Mass Production  
SMFDV032 K9D5608V0M 32M x 8 2.7~3.6 0~55°C 22 PAD Mass Production Dual Chip
SMFV032 K9S5608V0M 2.7~3.6 0~55°C 22 PAD Under Development  
SMFDV064 K9D1208V0M 64M x 8 2.7~3.6 0~55°C 22 PAD Under Development Dual Chip

Новая система обозначений Flash памяти фирмы Samsung Semiconductor

K 9 X XX XX X X X - X X X X X
1 2 3 4 5 6 7 8   9 10 11 12 13

1. Memory(K) 2. NAND Flash : 9
3. Small Classification
(SLC : Single Level Cell, MLC : Multi Level Cell, SM : SmartMedia)
  • F: SLC Normal
  • K: SLC Die Stack
  • S: SLC Single SM
  • T: MLC Single SM
  • D: SLC Dual SM
  • G: MLC Normal
  • L: MLC Die Stack
  • E: MLC Dual SM
4. Density
  • 40: 4M
  • 80: 8M
  • 16: 16M
  • 32: 32M
  • 64: 64M
  • 28: 128M
  • 56: 256M
  • 12: 512M
  • 1G: 1G
5. Organization
  • 08: x8
  • 16: x16
  • 32: x32
  • 64: x64
6. VCC
  • C: 5.0V(4.5V~5.5V)
  • V: 3.3V(3.0V~3.6V)
  • U: 2.7V~3.6V
  • W: 2.7V~5.5V,3.0V~5.5V
7. Reserved 8. Version Suffix
  • M: 1st Generation
  • A: 2nd Generation
  • B: 3rd Generation
  • C: 4th Generation
  • D: 5th Generation
  • E: 6th Generation
9. "-" 10. Package
  • C: CHIP BIZ
  • J: SOJ
  • T: TSOP2
  • W: WAFER
  • G: SOP
  • S: SmartMedia
  • R: TSOP2(R)
  • Y: TSOP1
11. Temperature
  • C: Commerial
  • I: Industrial
  • S: SmartMedia
  • 0: NONE
12. Bad Block
  • S: All Good Block
  • L: 1~5 Bad Block
  • B: Include Bad Block
  • 0: NONE(Water, CHIP BIZ)
13. Reserved

    

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